The shift in production to electric vehicles, expansion of services promoted by commercialized 5G, and recovery of capital investment in data centers are all signs of ever-increasing growth in the semiconductor market.


As this market is expected to show constant growth over time, Mitutoyo, as a solution provider and metrology expert, is ready to provide measurement solutions for various electronic manufacturing processes.


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Contact us to find out more about Mitutoyo's Quality assurance in the Electronics Industry



Common Parts Passing Through Quality Assurance in the Electronics Industry 



Semiconductors / Wafers


Semiconductors are an essential component of modern electronics, used in many devices you see on a daily basis. The manufacturing of semiconductors involves a complex process of layering materials on a wafer of silicon, followed by precision cutting and shaping to create individual chips.


One of the most critical steps in semiconductor production is the cutting of said wafers, as it determines the size and shape of each chip. Various techniques are used for wafer cutting, including mechanical sawing, laser cutting, and plasma cutting. This is a process that must be highly precise and accurate to ensure that each chip is identical and functional.



Quality Control Techniques

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Optical measurement

Techniques such as interferometry are used to measure the thickness, refractive index, and other physical properties of semiconductor layers.

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Profile Inspection

Used to measure the surface profile of semiconductor samples, this technique looks at features such as step heights, roughness, and surface flatness.

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Surface Roughness Measurement

One of the most important forms of quality control when it comes to silicon wafers is surface roughness. In order to obtain optimum electron mobility, a surface roughness profile with a low special wavelength is required.

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PCB / Soldering Pins / Wire Bonding


Printed Circuit Boards (PCBs) are a necessary component in electronic devices, providing a platform for connecting various components.


Soldered onto the PCBs to ensure stable electrical connections, pins are the channel through which communication can take place. Soldering pins requires careful attention to temperature, solder composition, and other factors to ensure this strong and reliable connection.


Wire bonding is another well-known process in the electronics industry, used to connect semiconductor devices between each other and to the leads of an integrated circuit. The quality of these connections is of the utmost importance if they are expected to perform as intended.



Quality Control Techniques

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Non-Contact Measurement

To measure the height and shape of PCB features and solder joints a vision measurement machine ensures that this can be performed without worry of damaging these delicate workpieces. Other optical inspection methods commonly used for measuring these components are white light interferometry and confocal microscopy.

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Cables / Connectors


Cables come in various types, including coaxial, twisted pair, and optical fiber, and are used to transmit data and power between devices. And connectors are used to join these cables together or connect them to devices directly. They come in many forms with the most common being USB, HDMI, and RJ45. As there are set specifications and standards for cables and connectors to ensure they operate accordingly, quality control is of the highest importance.


Quality Control Techniques

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Non-Contact Inspection

Surface inspection is one of the first tasks performed to check the surface and any micro-cracks or defects in connectors and cables that could cause issues over time. In cases like these, optical inspection systems lead the charge as these tasks can be automated, speeding up inspection time in smart factories across Europe.

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Dimensional measurement

Thanks to advanced non-contact measurement technology from Mitutoyo checking the physical dimensions of connectors and cables is extremely quick and easy. Measurement of connectors can be done quickly using automatic measurement programs on vision machines resulting in thousands of measurements in just a few minutes.



Our advanced CMM systems, laser-optical scanning technology and software analysis techniques are ideal for the 3D measurement necessary for complex electronics applications.


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